Nanoélec: preparing the new functionalities of tomorrow’s nanoelectronic technologies

Conducting a technology development and dissemination program in the information and communication technologies sector that directly benefits companies, especially SMEs/ETIs in all sectors.

Challenges

  • Create a world-class R&D department to develop 3D integration and silicon photonics technologies by using “Large Scientific Instruments” to characterize nanoelectronic materials and devices.
  • Spread technologies by developing new products or applications based on connectivity between objects and in connection with work carried out on uses. A specific program is devoted to SMEs/ETIs and gives them access to technological bricks to enrich their products or develop new ones.
  • Implement new training modules in order to satisfy the future needs of the economic players in the sphere.

Technological issues

  • Development of advanced micro-electronic technologies
  • Applicative dissemination of ICTs

Equipment and plateformes

  • Silicon 200- and 300-mm microelectronic cleanroom
  • Large characterization instruments
  • Development and integration spaces, and experimentation spaces
  • Training platforms

Lines of research

  • 3D silicon chip integration
  • Silicon photonics
  • Characterization (Large Instruments)
  • Internet of Things
  • Uses
  • Technological dissemination towards SMEs
  • New training modules

Main technical results

  • 3D integration: creation of an innovative 3D chip for processors (“3DNoC”) for the first time in the world.
  • Silicon photonics: integration of a demonstrated silicon laser, thereby removing a major barrier to the development of silicon photonic technology.
  • Creation of an autonomous building prototype implementing innovative solutions for managing resources.
Updated on February 19, 2020